Description
Outstanding Results
With its new formula, the MX-5 allows a low minimum bondline thickness and thus features in combination with a high thermal conductivity a very low thermal resistance. Thanks to its non-drying and non-bleeding properties, it guarantees a good long-term performance.
Highest Thermal Conductivity
The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC‘s MX-5 thermal paste is composed of carbon microparticles which fill these cavities. This leads to high thermal conductivity, guaranteeing that heat is dissipated efficiently from the CPUs, GPUs or power semiconductor components.



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